Technologies
Sonicrimp® Process
The Sonicrimp® Process is a simple, elegant, and efficient technique for terminating wires and contacts of virtually any size and combination to a wide variety of surfaces and substrates. This proprietary process can provide innumerable termination options, including custom strain reliefs, special contacts, a mix of wire sizes in the same connector, and a variety of other configurations. We can help you lower the cost of your existing products and show you ways to get more out of your electronic assemblies in your next generation of products.
How Sonicrimp® Works
Stripped wire is nested in the slots of a plastic cradle. Contacts are placed directly on the exposed conductors and the assembly is welded together with ultrasonic energy, simultaneously compressing and securing the contacts to the wires. The resulting crimp joint maximizes contact surface area for an excellent electrical termination. In addition, a stored energy is produced which keeps the contacts and wires in compression, even after extended heat aging and thermal cycling. There’s no solder, no IDC, and no overmolding.
Mass Termination Technique
Lower cost than more traditional methods such as hand soldering, crimp-on, or poke through contacts.
Precision Controlled Crimping Process
Provides superior termination onto delicate circuits such as polymer films and ceramic printed circuits.
Unique Crimp Barrel Designs
Adapts to any conductor size, and can accommodate varying wire sizes in a single part.
Multiple Functions in a Single Terminal
Adds cable strain relief, environmental sealing, mounting features, and other mechanical performance criteria.
No Solder Required
Eliminates the use of potentially hazardous materials and the contamination and cleaning associated with various solder processes.
Higher Density Potential
Permits more signals per linear inch than other mass termination methods without concern for solder bridging or contact misalignment.