Sonicrimp
Sonicrimp® is MDC’s patented process which provides a simple, elegant, and efficient technique for mass termination of wires and contacts of virtually any size and combination to a wide variety of surfaces and substrates.
The process begins with stripped wire nested in the grooves of the plastic cradle. Then an array of contacts, flexible circuitry, or a printed circuit board is placed directly on the exposed conductors. The plastic cap is put in place and the assembly is welded together with ultrasonic energy, compressing and securing the contacts to the wires simultaneously.