Benefits - 1210 Via Plugging Material
1210 Via Plugging Material provides low cost blind buried vias on double sided and multi layer P.C. Boards. It eliminates many of the expensive plating and laminating steps required to manufacture sequentially built up P.C. Boards and can reduce board manufacturing costs by 30%. The material offers a 100% solids system with virtually no shrinkage on curing. It is compatible with conventional copper plating techniques and offers excellent thermal and electrical conductivity. A flush surface reduces the amount of copper plating required in sequential build up.