Conductive and Resistive Inks / Circuit Technology

Methode Development Company offers a wide range of custom solutions using custom conductive resistive inks and circuit technology – including highly conductive silver inks, polymer thick film, cermet hybrids, 1210 via plugging, and flexible circuits. Custom ink technology offers significant cost and space savings. Products meet unique size, substrate material, resistance values, and tolerances as determined by customers' specific requirements. Inks can be specifically formulated to meet all of the following requirements:

  • Conductor
  • Resistor
  • EMC shielding
  • Jumper
  • Magnetic
  • Overprint
All inks can be sprayed or screened.

Click Here to View Methode's Conductive and Resistive Inks Brochure.



Conductive Ink Technology
 
 

NEWS

Methode to Present on Conductive Inkjet Inks at IMI's Sixth Annual Security Printing Conference
Methode’s innovative ink technology makes it possible to print a working electronic circuit on paper and polymer substrates via thermal or Piezo inkjet printers.     

Development Kit to Instantly Print Electrical Circuits
MDC's development kit allows engineers to create functional electrical circuits with a thermal inkjet desktop printer.     

Methode Development Company Introduces Conductive Ink with Low Electrical Resistance
Methode announces a new conductive ink formulated for thermal inkjet systems.     

Lightweight, Portable, and Cost-Effective Catering System
Methode has developed a lightweight and portable food-warming storage solution that uses Methode’s own carbon fiber heating technology to maintain a consistent temperature indefinitely.     

Methode Development Company Launches New Website
The new site features extensive information on MDC’s technologies and full product line and provides customers easy access to MDC’s design solutions.     

New Screen Printable Polymer Thick Film Silver Ink
This extremely conductive ink allows for aggressive miniaturization and increased functionality in electronic circuitry.     

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